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CIF AAB60, Single-Sided Photoresist Board FR4 With 35μm Copper Thick, 300 X 600 X 0.8mm

About The 8mm, Base Material: Epoxy Glass Fabric Laminate, Number of Sides: 1, Copper Thickness: 35µm, Length: 600mm, Thickness: 300mm.CIF AAB60, Single-Sided Photoresist Board FR4 With 35μm Copper Thick, 300 x 600 x 0

CIF AAB60, Single-Sided Photoresist Board FR4 With 35μm Copper Thick, 300 x 600 x 0.8mm, Base Material: Epoxy Glass Fabric Laminate, Number of Sides: 1, Copper Thickness: 35µm, Length: 600mm, Thickness: 300mm

Electronic Components & Power & Connectors > ESD Control & Cleanroom & PCB Prototyping > Prototyping Boards > Copper Clad Boards

CIF AAB60, Single-Sided Photoresist Board FR4 With 35μm Copper Thick, 300 X 600 X 0.8mm

Electronic Components & Power & Connectors > ESD Control & Cleanroom & PCB Prototyping > Prototyping Boards > Copper Clad Boards

Specifications of CIF AAB60, Single-Sided Photoresist Board FR4 With 35μm Copper Thick, 300 X 600 X 0.8mm

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CIF AAB60, Single-Sided Photoresist Board FR4 With 35μm Copper Thick, 300 X 600 X 0.8mm
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