CIF DZ2122, Double-Sided Photoresist Board FR4 With 35μm Copper Thick, 100 X 220 X 1.6mm

About The CIF DZ2122, Double-Sided Photoresist Board FR4 With 35μm Copper Thick, 100 x 220 x 1.6mm, Base Material: Epoxy Glass Fabric Laminate, Copper Thickness: 35µm, Length: 220mm, Thickness: 100mm

CIF DZ2122, Double-Sided Photoresist Board FR4 With 35μm Copper Thick, 100 x 220 x 1.6mm, Base Material: Epoxy Glass Fabric Laminate, Copper Thickness: 35µm, Length: 220mm, Thickness: 100mm

Electronic Components & Power & Connectors > ESD Control & Cleanroom & PCB Prototyping > Prototyping Boards > Copper Clad Boards

Vishay 1000μF Aluminium Electrolytic Capacitor 35V dc, Radial, Through Hole - MAL225090105E3

Vishay P-Channel MOSFET, 11 A, 200 V, 3-Pin TO-220AB IRF9640PBF, Mounting Type: Through Hole, Maximum Drain Source Resistance: 500 mΩ, Channel Mode: Enhancement, Minimum Gate Threshold Voltage: 2V, Maximum Power Dissipation: 125 W, Transistor Configuration: Single, Maximum Gate Source Voltage: -20 V, +20 V, Height: 9.01mm, Length: 10.41mm

Electronic Components & Power & Connectors > ESD Control & Cleanroom & PCB Prototyping > Prototyping Boards > Copper Clad Boards

Specifications of CIF DZ2122, Double-Sided Photoresist Board FR4 With 35μm Copper Thick, 100 X 220 X 1.6mm
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Last Updated January 10th, 2025 07:01 am

CIF DZ2122, Double-Sided Photoresist Board FR4 With 35μm Copper Thick, 100 X 220 X 1.6mm

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