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Onsemi NXH020F120MNF1PTG IGBT Module F1-4PACK Press-fit Pins With Pre-applied Thermal Interface Material (TIM) (Pb-Free

About The onsemi NXH020F120MNF1PTG IGBT Module F1-4PACK Press-fit Pins with pre-applied thermal interface material (TIM) (Pb-Free, Maximum Power Dissipation: 119 W, Package Type: F1-4PACK Press-fit Pins with pre-applied thermal interface material (TIM) (Pb-Free and Halide-Free)

onsemi NXH020F120MNF1PTG IGBT Module F1-4PACK Press-fit Pins with pre-applied thermal interface material (TIM) (Pb-Free, Maximum Power Dissipation: 119 W, Package Type: F1-4PACK Press-fit Pins with pre-applied thermal interface material (TIM) (Pb-Free and Halide-Free)

Electronic Components & Power & Connectors > Semiconductors > Discrete Semiconductors > IGBTs

Onsemi NXH020F120MNF1PTG IGBT Module F1-4PACK Press-fit Pins With Pre-applied Thermal Interface Material (TIM) (Pb-Free

Electronic Components & Power & Connectors > Semiconductors > Discrete Semiconductors > IGBTs

Specifications of Onsemi NXH020F120MNF1PTG IGBT Module F1-4PACK Press-fit Pins With Pre-applied Thermal Interface Material (TIM) (Pb-Free

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Onsemi NXH020F120MNF1PTG IGBT Module F1-4PACK Press-fit Pins With Pre-applied Thermal Interface Material (TIM) (Pb-Free
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    • onsemi NXH020F120MNF1PTG IGBT Module F1-4PACK Press-fit Pins with pre-applied thermal interface material (TIM) (Pb-Free, Maximum Power Dissipation: 119 W, Package Type: F1-4PACK Press-fit Pins with pre-applied thermal interface material (TIM) (Pb-Free and Halide-Free)
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    • onsemi NXH020F120MNF1PTG IGBT Module F1-4PACK Press-fit Pins with pre-applied thermal interface material (TIM) (Pb-Free, Maximum Power Dissipation: 119 W, Package Type: F1-4PACK Press-fit Pins with pre-applied thermal interface material (TIM) (Pb-Free and Halide-Free)