E-TEC 2.54mm Pitch Vertical 40 Way, Through Hole Turned Pin Open Frame IC Dip Socket, 1A, Row Width: 15.24mm, Termination Method: Solder, Contact Plating: Gold, Tin, Length: 50.8mm, Width: 2.41mm, Depth: 17.78mm, Dimensions: 50.8 x 2.41 x 17.78mm, Contact Material: Beryllium Copper, MPN: LOP-640-S083-95
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E-TEC 2.54mm Pitch Vertical 40 Way, Through Hole Turned Pin Open Frame IC Dip Socket, 1A
Specifications of E-TEC 2.54mm Pitch Vertical 40 Way, Through Hole Turned Pin Open Frame IC Dip Socket, 1A | |
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Instock | instock |