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SPREADFAST Heatsink, Universal Square Ceramic, 10.4 °C/W @ 100 Lfm, 6.2 °C/W @ 400 Lfm, 55 X 55 X 6mm, Adhesive, Screw

About The SPREADFAST Heatsink, Universal Square Ceramic, 10.4 °C/W @ 100 lfm, 6

SPREADFAST Heatsink, Universal Square Ceramic, 10.4 °C/W @ 100 lfm, 6.2 °C/W @ 400 lfm, 55 x 55 x 6mm, Adhesive, Screw, Length: 55mm, Colour: White, Series: Finned, Application: Chipset, Cooling, IC Cooling, LED, Metal Heat Sink Replacement, Power Modules, Special Features: Lower Density, High Breakdown Voltage, Good Heat Spreader, High Volume Resistivity, Good EMC, Ideal for Direct Metalisation, Good Thermal Cycling Stability, MPN: SF-CHS-555506F

Electrical & Automation & Cables > HVAC & Fans & Thermal Management > Electronics Heating & Cooling Components > Heatsinks

SPREADFAST Heatsink, Universal Square Ceramic, 10.4 °C/W @ 100 Lfm, 6.2 °C/W @ 400 Lfm, 55 X 55 X 6mm, Adhesive, Screw

ams OSRAM 3.1 V White LED 3737 SMD, P 3737 GW PUSTA1.PM-NDPA-XX57-1-1050-R18, Mounting Type: Surface Mount, Viewing Angle: 120 °, Luminous Flux: 460 (ND) lm, 500 (PA) lm, Colour Temperature: 3000K, Dimensions: 3.7 x 2.15 x 3.7mm, Forward Current: 3000mA, MPN: Q65112A6212
SPREADFAST Heatsink, Universal Square Ceramic, 12.7 °C/W @ 400 lfm, 24.0 °C/W @ 100 lfm, 23 x 23 x 10mm, Adhesive, Screw, Length: 23mm, Colour: White, Series: Pin Fin, Application: Chipset, Cooling, IC Cooling, LED, Metal Heat Sink Replacement, Power Modules, Special Features: Lower Density, High Breakdown Voltage, Good Heat Spreader, High Volume Resistivity, Good EMC, Ideal for Direct Metalisation, Good Thermal Cycling Stability, MPN: SF-CHS-232310-PC
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Electrical & Automation & Cables > HVAC & Fans & Thermal Management > Electronics Heating & Cooling Components > Heatsinks

Specifications of SPREADFAST Heatsink, Universal Square Ceramic, 10.4 °C/W @ 100 Lfm, 6.2 °C/W @ 400 Lfm, 55 X 55 X 6mm, Adhesive, Screw

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SPREADFAST Heatsink, Universal Square Ceramic, 10.4 °C/W @ 100 Lfm, 6.2 °C/W @ 400 Lfm, 55 X 55 X 6mm, Adhesive, Screw
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    • SPREADFAST Heatsink, Universal Square Ceramic, 12.7 °C/W @ 400 lfm, 24.0 °C/W @ 100 lfm, 23 x 23 x 10mm, Adhesive, Screw, Length: 23mm, Colour: White, Series: Pin Fin, Application: Chipset, Cooling, IC Cooling, LED, Metal Heat Sink Replacement, Power Modules, Special Features: Lower Density, High Breakdown Voltage, Good Heat Spreader, High Volume Resistivity, Good EMC, Ideal for Direct Metalisation, Good Thermal Cycling Stability, MPN: SF-CHS-232310-PC
    • SPREADFAST Heatsink, Universal Square Ceramic, 10.4 °C/W @ 100 lfm, 6.2 °C/W @ 400 lfm, 55 x 55 x 6mm, Adhesive, Screw, Length: 55mm, Colour: White, Series: Finned, Application: Chipset, Cooling, IC Cooling, LED, Metal Heat Sink Replacement, Power Modules, Special Features: Lower Density, High Breakdown Voltage, Good Heat Spreader, High Volume Resistivity, Good EMC, Ideal for Direct Metalisation, Good Thermal Cycling Stability, MPN: SF-CHS-555506F
    • ams OSRAM 3.1 V White LED 3737 SMD, P 3737 GW PUSTA1.PM-NDPA-XX57-1-1050-R18, Mounting Type: Surface Mount, Viewing Angle: 120 °, Luminous Flux: 460 (ND) lm, 500 (PA) lm, Colour Temperature: 3000K, Dimensions: 3.7 x 2.15 x 3.7mm, Forward Current: 3000mA, MPN: Q65112A6212
    • SPREADFAST Heatsink, Universal Square Ceramic, 10.4 °C/W @ 100 lfm, 6.2 °C/W @ 400 lfm, 55 x 55 x 6mm, Adhesive, Screw, Length: 55mm, Colour: White, Series: Finned, Application: Chipset, Cooling, IC Cooling, LED, Metal Heat Sink Replacement, Power Modules, Special Features: Lower Density, High Breakdown Voltage, Good Heat Spreader, High Volume Resistivity, Good EMC, Ideal for Direct Metalisation, Good Thermal Cycling Stability, MPN: SF-CHS-555506F
    • ams OSRAM 3.1 V White LED 3737 SMD, P 3737 GW PUSTA1.PM-NDPA-XX57-1-1050-R18, Mounting Type: Surface Mount, Viewing Angle: 120 °, Luminous Flux: 460 (ND) lm, 500 (PA) lm, Colour Temperature: 3000K, Dimensions: 3.7 x 2.15 x 3.7mm, Forward Current: 3000mA, MPN: Q65112A6212