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ASSMANN WSW 2.54mm Pitch Vertical 8 Way, Through Hole Turned Pin Open Frame IC Dip Socket, 3A

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ASSMANN WSW 2.54mm Pitch Vertical 8 Way, Through Hole Turned Pin Open Frame IC Dip Socket, 3A, Row Width: 7.62mm, Termination Method: Solder, Contact Plating: Tin, Length: 10.16mm, Depth: 3mm, Dimensions: 10.16 x 10.16 x 3mm, Contact Material: Brass, Phosphor Bronze, MPN: AR 08 HZL-TT

Electronic Components & Power & Connectors > Connectors > IC Sockets & Adapters > DIL Sockets

ASSMANN WSW 2.54mm Pitch Vertical 8 Way, Through Hole Turned Pin Open Frame IC Dip Socket, 3A

More from ASSMANN WSW, ASSMANN WSW 2.54mm Pitch Vertical 8 Way, Through Hole Turned Pin Open Frame IC Dip Socket, 3A, Row Width: 7.62mm, Termination Method: Solder, Contact Plating: Tin, Length: 10.16mm, Depth: 3mm, Dimensions: 10.16 X 10.16 X 3mm, Contact Material: Brass, Phosphor Bronze, MPN: AR 08 HZL-TT
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Specifications of ASSMANN WSW 2.54mm Pitch Vertical 8 Way, Through Hole Turned Pin Open Frame IC Dip Socket, 3A

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ASSMANN WSW 2.54mm Pitch Vertical 8 Way, Through Hole Turned Pin Open Frame IC Dip Socket, 3A
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    • ASSMANN WSW 2.54mm Pitch Vertical 8 Way, Through Hole Turned Pin Open Frame IC Dip Socket, 3A, Row Width: 7.62mm, Termination Method: Solder, Contact Plating: Tin, Length: 10.16mm, Depth: 3mm, Dimensions: 10.16 x 10.16 x 3mm, Contact Material: Brass, Phosphor Bronze, MPN: AR 08 HZL-TT
    • Siemens SIRIUS Memory Module, For Use With: Expansion Module Overload Relay, MPN: 3RB2985-2AA0
    • ASSMANN WSW 2.54mm Pitch Vertical 8 Way, Through Hole Turned Pin Open Frame IC Dip Socket, 3A, Row Width: 7.62mm, Termination Method: Solder, Contact Plating: Tin, Length: 10.16mm, Depth: 3mm, Dimensions: 10.16 x 10.16 x 3mm, Contact Material: Brass, Phosphor Bronze, MPN: AR 08 HZL-TT