E-TEC 2.54mm Pitch Right Angle 20 Way, Through Hole Turned Pin Closed Frame IC Dip Socket, Row Width: 7.62mm, Termination Method: Solder, Contact Plating: Gold, Tin, Width: 10.16mm, Depth: 13.22mm, Contact Material: Beryllium Copper, MPN: LEH-320-S900-95
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E-TEC 2.54mm Pitch Right Angle 20 Way, Through Hole Turned Pin Closed Frame IC Dip Socket
Specifications of E-TEC 2.54mm Pitch Right Angle 20 Way, Through Hole Turned Pin Closed Frame IC Dip Socket | |
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Instock | instock |