E-TEC 2.54mm Pitch Vertical 6 Way, Through Hole Turned Pin Open Frame IC Dip Socket, Row Width: 7.62mm, Termination Method: Solder, Contact Plating: Gold, Tin, Length: 7.6mm, Width: 4.45mm, Contact Material: Beryllium Copper, Housing Material: PBT, MPN: POS-306-S001-95
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E-TEC 2.54mm Pitch Vertical 6 Way, Through Hole Turned Pin Open Frame IC Dip Socket
Specifications of E-TEC 2.54mm Pitch Vertical 6 Way, Through Hole Turned Pin Open Frame IC Dip Socket | |
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Instock | instock |