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E-TEC 2.54mm Pitch Vertical 40 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A

About The 24mm, Termination Method: Solder, Contact Plating: Tin, Length: 50.01mm, Depth: 17

E-TEC 2.54mm Pitch Vertical 40 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A, Row Width: 15.24mm, Termination Method: Solder, Contact Plating: Tin, Length: 50.67mm, Width: 5.01mm, Depth: 17.7mm, Dimensions: 50.67 x 5.01 x 17.7mm, Contact Material: Beryllium Copper, MPN: LOC-640-S051-99

Electronic Components & Power & Connectors > Connectors > IC Sockets & Adapters > DIL Sockets

E-TEC 2.54mm Pitch Vertical 40 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A

Electronic Components & Power & Connectors > Connectors > IC Sockets & Adapters > DIL Sockets

Specifications of E-TEC 2.54mm Pitch Vertical 40 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A

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E-TEC 2.54mm Pitch Vertical 40 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A
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