CIF AB60, Double-Sided Photoresist Board FR4 With 35μm Copper Thick, 300 x 600 x 1.6mm, Base Material: Epoxy Glass Fabric Laminate, Number of Sides: 2, Copper Thickness: 35µm, Length: 600mm, Thickness: 300mm
Electronic Components & Power & Connectors > ESD Control & Cleanroom & PCB Prototyping > Prototyping Boards > Copper Clad Boards
CIF AB60, Double-Sided Photoresist Board FR4 With 35μm Copper Thick, 300 X 600 X 1.6mm
Specifications of CIF AB60, Double-Sided Photoresist Board FR4 With 35μm Copper Thick, 300 X 600 X 1.6mm | |
---|---|
Category | |
Instock | instock |