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CIF ABB20, Double-Sided Photoresist Board FR4 With 35μm Copper Thick, 200 X 300 X 0.8mm

About The 8mm, Base Material: Epoxy Glass Fabric Laminate, Copper Thickness: 35µm, Length: 300mm, Thickness: 200mm.CIF ABB20, Double-Sided Photoresist Board FR4 With 35μm Copper Thick, 200 x 300 x 0

CIF ABB20, Double-Sided Photoresist Board FR4 With 35μm Copper Thick, 200 x 300 x 0.8mm, Base Material: Epoxy Glass Fabric Laminate, Copper Thickness: 35µm, Length: 300mm, Thickness: 200mm

Electronic Components & Power & Connectors > ESD Control & Cleanroom & PCB Prototyping > Prototyping Boards > Copper Clad Boards

CIF ABB20, Double-Sided Photoresist Board FR4 With 35μm Copper Thick, 200 X 300 X 0.8mm

Electronic Components & Power & Connectors > ESD Control & Cleanroom & PCB Prototyping > Prototyping Boards > Copper Clad Boards

Specifications of CIF ABB20, Double-Sided Photoresist Board FR4 With 35μm Copper Thick, 200 X 300 X 0.8mm

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CIF ABB20, Double-Sided Photoresist Board FR4 With 35μm Copper Thick, 200 X 300 X 0.8mm
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